Method and apparatus for producing a ceramic electronic component

ABSTRACT

A method for producing a laminated ceramic capacitor allows a surface of at least a portion of a ceramic element body chip to be brought into contact with a plated layer formed in advance in a mold member, and performs heat processing on the ceramic element body chip in that contact state, thereby to form an external conductor layer made of the plated layer on the surface of at least the portion of the ceramic element body chip. Thus, a method and an apparatus for producing a ceramic electronic component accurately and precisely controls the thickness of the external conductor layer to be small, and easily controls the length of the external conductor layer.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention generally relates to a method and an apparatus forproducing a ceramic electronic component, and more specifically to amethod and an apparatus for producing a chip-type ceramic electroniccomponent such as a laminated ceramic capacitor.

2. Description of the Related Art

Conventionally, a laminated ceramic capacitor is produced, for example,in the following manner.

First, a slurry containing a ceramic source material powder is prepared.This slurry is molded into a sheet so as to prepare a ceramic greensheet. On the surface of the ceramic green sheet, an electricallyconductive paste serving as a source material of an internal electrodelayer is applied according to a predetermined pattern. This conductivepaste is composed of a metal powder, a solvent, and a varnish.

Next, a plurality of ceramic green sheets on which the conductive pastehas been applied are laminated and thermally pressed to fabricate anintegrated crude laminate body. By sintering this crude laminate body, aceramic laminate body is fabricated. In the inside of this ceramiclaminate body, a plurality of internal electrode layers are formed. Endsurfaces of a portion of the internal electrode layers are exposed tothe outside surface of the ceramic laminate body.

Next, an electrically conductive paste serving as a source material ofan external electrode layer is applied onto the outside surface of theceramic laminate body at which the end surfaces of a portion of theinternal electrode layers are exposed, followed by firing the ceramiclaminate body. This conductive paste is composed of a metal powder, aglass frit, a solvent, and a varnish. By this process, an externalelectrode layer is formed on the outside surface of the ceramic laminatebody so as to be electrically connected to specific internal electrodelayers.

Finally, a plated layer is formed on the surface of the externalelectrode layer in accordance with the needs in order to enhance thesoldering performance.

FIG. 12 is a cross-sectional view illustrating a conventional laminatedceramic capacitor.

Referring to FIG. 12, a laminated ceramic capacitor 5 serving as oneexample of a ceramic electronic component includes a ceramic laminatebody 50 having a rectangular parallelepiped shape. One end surface ofeach of the plurality of internal electrode layers 51 is formed so as toextend up to the outside surface of the ceramic laminate body 50. Onboth side surfaces of the ceramic laminate body 50, end surfaces of theplurality of internal electrode layers 51 are arranged so as to bealternately exposed. The external electrode layer 52 is formed on bothside surfaces of the ceramic laminate body 50 so as to be electricallyconnected to specific internal electrode layers 51. The wrap-around ends53 of the external electrode layer 52 are formed to extend to or wraparound to both ends of the upper and lower surfaces of the ceramiclaminate body 50.

In the meantime, in recent years, scale reduction and capacitanceincrease of a laminate ceramic capacitor are demanded. However,according to the above-described production method, the externalelectrode layer is formed by applying an electrically conductive paste,so that the thickness of the external electrode layer is several tens toseveral hundreds of μm. For this reason, a thick external electrodelayer is an obstacle preventing a larger capacitance with a smallervolume from being obtained in a laminated ceramic capacitor. Therefore,thickness reduction of the external electrode layer serving as anexternal conductor layer is demanded.

For example, Japanese Patent Application Laid-open (JP-A) No. 63-169014discloses two methods of a conventional example and an inventive exampleas a method of forming an external electrode terminal of a chipcapacitor.

According to one method disclosed as a conventional example in JP-A No.63-169014, an activated layer is attached to the whole surface of a chipcapacitor element, and an electrically conductive metal layer isdeposited on the whole surface of the chip capacitor element bynon-electrolytic plating. Then, with use of an etching-resistant layerformed on a portion of the conductive metal layer as a mask, theconductive metal layer is selectively removed by etching, so as to forman external electrode.

According to the other method disclosed as an inventive example in JP-ANo. 63-169014, an electrically conductive metal layer is deposited onthe whole side wall surfaces at both opposite ends of a chip capacitorelement by non-electrolytic plating so that the internal electrodelayers exposed to the side wall surfaces will be short-circuited, so asto form an external electrode.

As shown in FIG. 12, in order to perform surface mounting of a laminatedceramic capacitor 5 onto a substrate or the like, the external electrodelayer 52 is formed to extend not only to both side surfaces of theceramic laminate body 50 but also to both ends of the upper and lowersurfaces of the ceramic laminate body 50. In this case, the length ofthe wrap-around ends 53 of the external electrode layer 52 formed onboth ends of the upper and lower surfaces of the ceramic laminate body50 must be controlled to be an almost constant length.

According to the one method of forming an external electrode terminaldisclosed in JP-A No. 63-169014, the external electrode is formed byselectively removing the conductive metal layer by etching with the useof a mask. By this forming method, the length of the wrap-around ends 53of the external electrode layer 52 such as shown in FIG. 12 can becontrolled to be an almost constant length. However, this causes aproblem in that, for the control, cumbersome production steps of amasking step and an etching step are needed. Also, since such cumbersomeproduction steps must be carried out, it will be extremely difficult tocontrol the length of the wrap-around ends 53 of the external electrodelayer 52 to be an almost constant length when the scale of the chipcapacitor element is reduced.

Also, according to the other method of forming an external electrodeterminal disclosed in JP-A No. 63-169014, non-electrolytic plating iscarried out by using an internal electrode layer exposed to the sidewall surfaces at both ends of the chip capacitor element, so that theexternal electrode layer 52 can be formed on both side surfaces of theceramic laminate body 50 as shown in FIG. 12. However, it is notpossible to form the wrap-around ends 53 of the external electrode layer52 so as to extend to both ends of the upper and lower surfaces of theceramic laminate body 50. In order to form the wrap-around ends 53 ofthe external electrode layer 52 so as to extend to both ends of theupper and lower surfaces of the ceramic laminate body 50, an activatedlayer must be formed in a region in which the wrap-around ends 53 are tobe formed. In this case, a problem is caused such that cumbersomeproduction steps of a masking step and an etching step are needed forselectively forming an activated layer for the purpose of controllingthe length of the wrap-around ends 53 of the external electrode layer 52such as shown in FIG. 12 to be an almost constant length. Also, sincesuch cumbersome production steps must be carried out, it will beextremely difficult to control the length of the wrap-around ends 53 ofthe external electrode layer 52 to be an almost constant length when thescale of the chip capacitor element is reduced.

SUMMARY OF THE INVENTION

Preferred embodiments of the present invention provide a method and anapparatus for producing a ceramic electronic component that can controlthe thickness of the external conductor layer to be small, and caneasily control the length of the external conductor layer.

A method for producing a ceramic electronic component according to apreferred embodiment of the present invention is a method for producinga ceramic electronic component including a ceramic element body andincludes a step of allowing a surface of at least a portion of theceramic element body to be brought into contact with a plated layerformed in advance on a member different from the ceramic element body,and a step of performing heat processing on the ceramic element body ina state in which the surface of at least the portion of the ceramicelement body is in contact with the plated layer, thereby to form anexternal conductor layer made of the plated layer on the surface of theportion of the ceramic element body.

By the method of producing a ceramic electronic component according to apreferred embodiment of the present invention, a plated layer is formedin advance on a member different from the ceramic element body, so thatthe dimensions such as the thickness and the length of the plated layerare defined in advance. For this reason, by performing heat processingon the ceramic element body in a state in which the surface of at leastthe portion of the ceramic element body is in contact with the platedlayer, the variation in the dimensions such as the thickness and thelength of the external conductor layer made of the plated layer formedon the surface of the portion of the ceramic element body is small amongthe plurality of ceramic electronic components, so that the thicknessand the length of the external conductor layer can be easily controlled.Also, since the external conductor layer is made of a plated layer, thethickness of the external conductor layer can be reduced. Further, sincethe external conductor layer is formed by transcription of the platedlayer formed in advance on a member different from the ceramic elementbody onto the surface of the portion of the ceramic element body,defects are prevented from being generated in the external conductorlayer even when the thickness of the plated layer is reduced.

Here, by the method of producing a ceramic electronic componentaccording to a preferred embodiment of the present invention, there isno need to immerse the ceramic element body into a plating solution inorder to form an external conductor layer made of a plated layer on thesurface of the portion of the ceramic element body, so that it ispossible to prevent a decrease in the reliability caused by penetrationof the plating solution into the ceramic element body.

A method for producing a ceramic electronic component according toanother preferred embodiment of the present invention is a method forproducing a ceramic electronic component including a ceramic elementbody and includes the steps of a step of forming a plated layer on aninside surface of a recess of a mold member into which a portion of theceramic element body can be inserted and fitted, a step of allowing asurface of the portion of the ceramic element body to be brought intocontact with the plated layer formed on the inside surface of the recessof the mold member by inserting and fitting the portion of the ceramicelement body into the recess of the mold member, a step of performingheat processing on the ceramic element body in a state in which thesurface of the portion of the ceramic element body is in contact withthe plated layer, thereby to form an external conductor layer made ofthe plated layer on the surface of the portion of the ceramic elementbody, and a step of separating the ceramic element body, on which theexternal conductor layer is formed, from the mold member.

By the method of producing a ceramic electronic component according toanother preferred embodiment of the present invention, the followingfunctions and effects can be produced in addition to the functions andeffects produced by the production method according to above preferredembodiment of the present invention.

By the method of producing a ceramic electronic component according toanother preferred embodiment of the present invention, the surface ofthe portion of the ceramic element body is allowed to be brought intocontact with the plated layer formed on the inside surface of the recessof the mold member by inserting and fitting the portion of the ceramicelement body into the recess of the mold member. By performing heatprocessing on the ceramic element body in a state in which the surfaceof the portion of the ceramic element body is in contact with the platedlayer formed on the inside surface of the recess of the mold member, anexternal conductor layer made of the plated layer is formed on thesurface of the portion of the ceramic element body. For this reason, theexternal conductor layer can be formed on both side surfaces of theceramic element body simply by using a mold member having a recess onwhich a plated layer is formed in advance, without using the cumbersomeproduction steps of the masking step and the etching step. In addition,both ends of the external conductor layer can be easily formed to extendup to both ends of the upper and lower surfaces of the ceramic elementbody.

Here, by using a mold member having a recess, the plated layer formed inadvance can be easily brought into contact with the surface of theportion of the ceramic element body.

In the method for producing a ceramic electronic component according toanother preferred embodiment of the present invention, preferably, thestep of forming the plated layer on the inside surface of the recess ofthe mold member is carried out preferably by electrolytic plating, aportion of the mold member on which the plated layer is to be formed ismade of a conductor, and a portion of the mold member on which theplated layer is not to be formed is made of an insulator.

In this case, the plated layer can be easily formed selectively on onlythe conductor portion preferably by electrolytic plating on the insidesurface of the recess of the mold member. Also, the plated layer can beselectively formed or the plated layer can be patterned without usingcumbersome steps of the masking step and the etching step. This makes itpossible for the production method according to a preferred embodimentof the present invention to be applied even to a case of producing aceramic electronic component having numerous terminals in which aplurality of external electrodes serving as external conductor layersare formed on the outer surface of the ceramic element body.

Here, the portion on which the plated layer is formed may be the wholeor a portion of the inside surface of the recess of the mold member.

In the method for producing a ceramic electronic component according toanother preferred embodiment of the present invention, preferably, thestep of forming the plated layer on the inside surface of the recess ofthe mold member is preferably carried out by non-electrolytic plating, aportion of the mold member on which the plated layer is to be formed ismade of a material that has a catalytic activity with respect to areducing agent contained in a non-electrolytic plating bath, and aportion of the mold member on which the plated layer is not to be formedis made of a material that does not have a catalytic activity withrespect to the reducing agent contained in the non-electrolytic platingbath.

In this case, the plated layer can be easily formed selectively on onlythe portion made of the material having a catalytic activity preferablyby non-electrolytic plating on the inside surface of the recess of themold member. Also, the plated layer can be selectively formed or theplated layer can be patterned without using the cumbersome steps of themasking step and the etching step. This makes it possible for theproduction method according to a preferred embodiment of the presentinvention to be applied even to a case of producing a ceramic electroniccomponent having numerous terminals in which a plurality of externalelectrodes serving as external conductor layers are formed on the outersurface of the ceramic element body.

Here, the portion on which the plated layer is formed may be the wholeinside surface or a portion of the inside surface of the recess of themold member.

In the method for producing a ceramic electronic component according tovarious preferred embodiments of the present invention, preferably, theheat processing on the ceramic element body is carried out at atemperature higher than a temperature at which a metal contained in theplated layer reacts with oxygen contained in the ceramic element body toyield a product.

In this case, by the presence of the product, firm close adhesion of theplated layer and the ceramic element body with each other can beachieved. By this process, the close adhesion property of the externalconductor layer made of the plated layer to the ceramic element body canbe enhanced.

In the method for producing a ceramic electronic component according tovarious preferred embodiments of the present invention, preferably, theceramic element body includes a plurality of laminated ceramic layersand a plurality of internal conductor layers disposed between theplurality of ceramic layers, and a surface of a portion of the internalconductor layers is exposed to an outside surface of the ceramic elementbody. Then, preferably, the external conductor layer is formed to beelectrically connected to the internal conductor layers in the step offorming the external conductor layer made of the plated layer on thesurface of the portion of the ceramic element body.

In this case, the production method according to a preferred embodimentof the present invention can be applied, for example, to production of alaminated ceramic capacitor of a chip type, so that a larger capacitancecan be obtained with a smaller volume in a laminated ceramic capacitor.

A method for producing a ceramic electronic component according toanother preferred embodiment of the present invention is a method forproducing a ceramic electronic component having a ceramic element body,wherein the above-mentioned steps are successively carried out.

By doing so, a method of forming an external conductor layer beingexcellent in mass productivity can be provided in a method of producinga ceramic electronic component.

In the method for producing a ceramic electronic component according toanother preferred embodiment of the present invention, preferably, aplated layer is formed on an inside surface of a recess of a first moldmember, and a plated layer is formed on an inside surface of a recess ofa second mold member in the step of forming the plated layer on theinside surface of the recess of the mold member. Then, preferably, asurface of a portion on one side of the ceramic element body is allowedto be brought into contact with the plated layer formed on the insidesurface of the recess of the first mold member by inserting and fittingthe portion on the one side of the ceramic element body into the recessof the first mold member, and a surface of a portion on the other sideopposite to the one side of the ceramic element body is allowed to bebrought into contact with the plated layer formed on the inside surfaceof the recess of the second mold member by inserting and fitting theportion on the other side of the ceramic element body into the recess ofthe second mold member in the step of allowing the surface of theportion of the ceramic element body to be brought into contact with theplated layer formed on the inside surface of the recess of the moldmember.

By doing so, a method of forming an external conductor layer being evenmore excellent in mass productivity can be provided in a method ofproducing a ceramic electronic component.

In the method for producing a ceramic electronic component, preferably,a major component of the plated layer is nickel (Ni) or copper (Cu), forexample.

An apparatus for producing a ceramic electronic component according to apreferred embodiment of the present invention is an apparatus forproducing a ceramic electronic component including a ceramic elementbody, the apparatus including a first station arranged to form a platedlayer on an inside surface of a recess of a mold member into which aportion of the ceramic element body can be inserted and fitted, a secondstation arranged to allow a surface of the portion of the ceramicelement body to be brought into contact with the plated layer formed onthe inside surface of the recess of the mold member by inserting andfitting the portion of the ceramic element body into the recess of themold member, a third station arranged to perform heat processing on theceramic element body in a state in which the surface of the portion ofthe ceramic element body is in contact with the plated layer, thereby toform an external conductor layer made of the plated layer on the surfaceof the portion of the ceramic element body, and a fourth stationarranged to separate the ceramic element body, on which the externalconductor layer is formed, from the mold member.

By doing so, an apparatus for forming an external conductor layer beingexcellent in mass productivity can be provided in an apparatus forproducing a ceramic electronic component.

In the apparatus for producing a ceramic electronic component accordingto a preferred embodiment of the present invention, preferably, thefirst station arranged to form the plated layer on the inside surface ofthe recess of the mold member includes a station arranged to form aplated layer on an inside surface of a recess of a first mold member,and a station arranged to form a plated layer on an inside surface of arecess of a second mold member. Then, preferably, the second stationarranged to allow the surface of the portion of the ceramic element bodyto be brought into contact with the plated layer formed on the insidesurface of the recess of the mold member includes a station arranged toallow a surface of a portion on one side of the ceramic element body tobe brought into contact with the plated layer formed on the insidesurface of the recess of the first mold member by inserting and fittingthe portion on the one side of the ceramic element body into the recessof the first mold member, and a station arranged to allow a surface of aportion on the other side opposite to the one side of the ceramicelement body to be brought into contact with the plated layer formed onthe inside surface of the recess of the second mold member by insertingand fitting the portion on the other side of the ceramic element bodyinto the recess of the second mold member.

By doing so, an apparatus for forming an external conductor layer beingeven more excellent in mass productivity can be provided in an apparatusfor producing a ceramic electronic component.

A plurality of ceramic electronic components produced by using theproduction method according to a preferred embodiment of the presentinvention are a plurality of ceramic electronic components in which aplated layer is formed on a surface of a portion of each of a pluralityof ceramic element bodies, including a plurality of ceramic elementbodies and a plurality of plated layers. The plurality of ceramicelement bodies have upper and lower surfaces and left and right sidesurfaces connecting the upper and lower surfaces. The plurality ofplated layers are constructed in such a manner that each of the platedlayers is arranged to extend from one end of the upper surface of eachof the plurality of ceramic element bodies to one end of the lowersurface by passing through at least one of the left side surface and theright side surface. The ratio of the standard deviation relative to anaverage value of the lengths of the plurality of plated layers disposedon one end of either of the upper surface and the lower surface of eachof the plurality of ceramic element bodies is about 3% or less.

In this manner, in a ceramic electronic component produced by theproduction method according to a preferred embodiment of the presentinvention, the length of both ends of the plated layer constituting theexternal conductor layer can be accurately and precisely controlled.

In the plurality of ceramic electronic components produced by theproduction method according to a preferred embodiment of the presentinvention, preferably, a ratio of a standard deviation relative to anaverage value of thicknesses of the plurality of plated layers is about5% or less.

By doing so, also the thickness of the plated layer constituting theexternal conductor layer can be accurately and precisely controlled.

As described above, according to various preferred embodiments of thepresent invention, the thickness of the external conductor layer can becontrolled to be small, and the length of the external conductor layercan be easily controlled. This makes it possible for scale reduction andcapacitance increase of a ceramic electronic component such as alaminated ceramic capacitor of a chip type, for example, to be easilyrealized.

Other features, elements, steps, characteristics and advantages of thepresent invention will become more apparent from the following detaileddescription of preferred embodiments of the present invention withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic cross-sectional view illustrating the first stepof producing a laminated ceramic capacitor which is one example of aceramic electronic component according to a preferred embodiment of thepresent invention.

FIG. 2 is a schematic cross-sectional view illustrating the second stepof producing a laminated ceramic capacitor which is one example of aceramic electronic component according to a preferred embodiment of thepresent invention.

FIG. 3 is a schematic cross-sectional view illustrating the third stepof producing a laminated ceramic capacitor which is one example of aceramic electronic component according to a preferred embodiment of thepresent invention.

FIG. 4 is a schematic cross-sectional view illustrating the fourth stepof producing a laminated ceramic capacitor which is one example of aceramic electronic component according to a preferred embodiment of thepresent invention.

FIG. 5 is a schematic cross-sectional view illustrating the fifth stepof producing a laminated ceramic capacitor which is one example of aceramic electronic component according to a preferred embodiment of thepresent invention.

FIG. 6 is a schematic cross-sectional view illustrating a modifiedexample of the fourth step of producing a laminated ceramic capacitorwhich is one example of a ceramic electronic component according to apreferred embodiment of the present invention.

FIG. 7 is a schematic cross-sectional view illustrating a modifiedexample of the fifth step of producing a laminated ceramic capacitorwhich is one example of a ceramic electronic component according to apreferred embodiment of the present invention.

FIG. 8 is a schematic cross-sectional view illustrating the sixth stepof producing a laminated ceramic capacitor which is one example of aceramic electronic component according to a preferred embodiment of thepresent invention.

FIG. 9 is a schematic cross-sectional view illustrating the seventh stepof producing a laminated ceramic capacitor which is one example of aceramic electronic component according to a preferred embodiment of thepresent invention.

FIG. 10 is a cross-sectional view illustrating a laminated ceramiccapacitor obtained by the production method according to a preferredembodiment of the present invention.

FIG. 11 is a block diagram showing a schematic construction of anapparatus for producing a laminated ceramic capacitor which is oneexample of a ceramic electronic component according to a preferredembodiment of the present invention.

FIG. 12 is a cross-sectional view illustrating a conventional laminatedceramic capacitor.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereafter, preferred embodiments of the present invention will bedescribed with reference to the attached drawings.

FIGS. 1 to 9 are schematic cross-sectional views sequentiallyillustrating the steps of producing a laminated ceramic capacitor whichis one example of a ceramic electronic component according to variouspreferred embodiments of the present invention.

With reference to FIGS. 1 to 9, a method of forming an externalconductor layer made of an electrolytically plated layer in a laminatedceramic capacitor will be described.

First, as shown in FIG. 1, a ceramic layer 110 is formed on the portionof the surface of a mold member 100 where the plated layer is not to beformed. The portion where the plated layer is to be formed is left to bemade of the material of the mold member 100, for example, stainlesssteel. The portion where the plated layer is not to be formed may beleft to be made of stainless steel which is the material of the moldmember 100. However, in this case, by repetitively using the mold member100, unnecessary electrolytically plated layers will be deposited onthat portion, so that it is not preferable. The ceramic layer 110 is oneexample of an insulator and is made, for example, of a ceramic materialsuch as alumina or zirconia. Stainless steel serving as a material ofthe mold member 100 is just one example of a conductor, and the moldmember 100 may be made of another metal material. However, it isnecessary that the metal material serving as a material of the moldmember 100 have a melting point higher than the heat processingtemperature of a later step. Here, the mold member 100 has a recess intowhich a portion of a ceramic element body chip preferably having asubstantially rectangular parallelepiped shape, for example, mentionedlater can be inserted and fitted.

Next, as shown in FIG. 2, by the electrolytic plating method, a platedlayer 120, for example, a copper plated layer, is formed on an insidesurface of the recess of the mold member 100. The plated layer 120 maybe a nickel plated layer, for example.

Thereafter, as shown in FIG. 3, a chip guiding supporting jig 200 havinga ring shape is mounted on the ceramic layer 110 so as to surround therecess.

Then, as shown in FIG. 4, one side portion of a ceramic element bodychip 1 of a laminated ceramic capacitor is guided by the innercircumferential surface of the chip guiding supporting jig 200 so as toinsert and fit a portion of the ceramic element body chip 1 into therecess of the mold member 100. As a result, the surface of the portionof the ceramic element body chip 1, that is, the surface on which anexternal conductor layer is to be formed, can be brought into contactwith the plated layer 120 formed on the inside surface of the recess ofthe mold member 100. Also, the ceramic element body chip 1, a portion ofwhich is inserted and fitted into the recess of the mold member 100, issupported by the chip guiding supporting jig 200 and will not fall downor be dropped.

Here, the ceramic element body chip 1 of the laminated ceramic capacitorserving as one example of a ceramic electronic component includes aceramic laminate body 10 having a substantially rectangularparallelepiped shape, for example. One end surface of each of theplurality of internal conductor layers 11 is formed to extend up to theoutside surface of the ceramic laminate body 10. On both side surfacesof the ceramic laminate body 10, end surfaces of the plurality ofinternal conductor layers 11 are arranged so as to be alternatelyexposed.

As shown in FIG. 5, after the chip guiding supporting jig 200 is removedfrom the mold member 100, the mold member 100 and the ceramic elementbody chip 1 are put into a heat processing furnace 300 to perform heatprocessing in a state in which the surface of the ceramic element bodychip 1 is in contact with the plated layer 120. This heat processing iscarried out preferably at a temperature higher than the temperature atwhich the metal contained in the plated layer 120 and the oxygencontained in the ceramic element body chip 1 react with each other toyield a product. For example, when the metal contained in the platedlayer 120 is copper, the heat processing is carried out at a temperaturehigher than or equal to about 1065° C., whereby Cu₂O and CuO which areoxide of copper are produced as the aforesaid product in the vicinity ofthe interface between the plated layer 120 and the ceramic element bodychip 1.

In this manner, by performing heat processing on the ceramic elementbody chip 1 in a state in which the surface of the ceramic element bodychip 1 is in contact with the plated layer 120, an external conductorlayer 12 made of the plated layer is formed on the surface of one sideof the ceramic element body chip 1 as shown in FIG. 8. By the presenceof the aforesaid product, the plated layer 120 and the ceramic elementbody chip 1 can be firmly allowed to adhere closely to each other. Then,after cooling, the ceramic element body chip 1 on which the externalconductor layer 12 has been formed is separated from the mold member100.

In the above-described preferred embodiment, an example has beendescribed in which an external conductor layer 12 made of a plated layeris formed on the surface of one side of the ceramic element body chip 1.In a case in which an external conductor layer 12 made of a plated layeris formed on the surface of both sides of the ceramic element body chip1, first, as shown in FIG. 6, the chip guiding supporting jig 200 isremoved from the mold member 100. Another mold member 400 is prepared,and a ceramic layer 410 is formed on the portion of the surface of themold member 400 where the plated layer is not to be formed. By theelectrolytic plating method, a plated layer 420, for example, a copperplated layer, is formed on an inside surface of the recess of the moldmember 400. Another side portion on the opposite side of the ceramicelement body chip 1 of the laminated ceramic capacitor is inserted andfitted into the recess of the other mold member 400. As a result, thesurface of the other side portion as the surface of one portion of theceramic element body chip 1 can be brought into contact with the platedlayer 420 formed on the inside surface of the recess of the mold member400. In this manner, the surface of both sides of the ceramic elementbody chip 1 on which the external conductor layer is to be formed can bebrought into contact.

Then, as shown in FIG. 7, the mold member 100 and the ceramic elementbody chip 1 are put into a heat processing furnace 500 to perform heatprocessing in a state in which the surface of both sides of the ceramicelement body chip 1 is in contact with the plated layers 120, 420. Inthis manner, by performing heat processing on the ceramic element bodychip 1 in a state in which the surfaces of both sides of the ceramicelement body chip 1 are in contact with the plated layers 120, 420,external conductor layers 12, 42 made of the plated layer are formed onthe surfaces of both sides of the ceramic element body chip 1 as shownin FIG. 9. Then, after cooling, the ceramic element body chip 1 on whichthe external conductor layers 12, 42 have been formed is separated fromthe mold members 100, 400.

Here, in the case of forming an external conductor layer made of anon-electrolytically plated layer in a laminated ceramic capacitor, aceramic layer 110 may be formed on the portion of the surface of themold member 100 where the plated layer is not to be formed, as shown inFIG. 1. However, the portion where the plated layer is not to be formedmay be left to be made of the material of the mold member 100, forexample, stainless steel, which is one example of a material that doesnot have a catalytic activity with respect to formaldehyde which is oneexample of a reducing agent contained in a non-electrolytic platingbath. To the portion where the plated layer is to be formed, a materialcontaining, for example, palladium (Pd) particles, which are a catalystsubstance in the case of copper plating, is imparted as a material thathas a catalytic activity with respect to the reducing agent contained inthe non-electrolytic plating bath. Next, as shown in FIG. 2, by thenon-electrolytic plating method, a plated layer 120, for example, acopper plated layer, is formed on the inside surface of the recess ofthe mold member 100. The subsequent production steps are the same as inthe case of forming an external conductor layer made of anelectrolytically plated layer.

As described above, as one preferred embodiment of the presentinvention, in the method of producing a laminated ceramic capacitor, theplated layers 120, 420 are formed in advance on members different fromthe ceramic element body chip 1, so that the dimensions such as thethickness and the length of the plated layers 120, 420 are defined inadvance. For this reason, by performing heat processing on the ceramicelement body chip 1 in a state in which the surface of at least aportion of the ceramic element body chip 1 is in contact with the platedlayers 120, 420, the variations in the dimensions such as the thicknessand the length of the external conductor layers 12, 42 made of theplated layers formed on the surface of the portion of the ceramicelement body chip 1 are small among the plurality of laminated ceramiccapacitors, so that the thickness and the length of the externalconductor layers 12, 42 can be easily controlled. Also, since theexternal conductor layers 12, 42 are made of a plated layer, thethickness of the external conductor layers 12, 42 can be reduced.Further, since the external conductor layers 12, 42 are formed bytranscription of the plated layers 120, 420 formed in advance on themembers different from the ceramic element body chip 1 onto the surfaceof the portion of the ceramic element body chip 1, defects are hardlygenerated in the external conductor layers 12, 42 even when thethickness of the plated layers 120, 420 is reduced.

Here, in the method of producing a laminated ceramic capacitor accordingto a preferred embodiment of the present invention, the externalconductor layers 12, 42 made of a plated layer are formed on the surfaceof a portion of the ceramic element body chip 1, so that there is noneed to immerse the ceramic element body chip 1 into a plating solution,whereby the decrease in the reliability caused by penetration of theplating solution into the ceramic element body chip 1 can be prevented.

When the method of producing a laminated ceramic capacitor according toa preferred embodiment of the present invention described above isviewed from another aspect, the following functions and effects can beproduced in addition to the above-described functions and effects.

The surface of a portion of the ceramic element body chip 1 is allowedto be brought into contact with the plated layers 120, 420 formed on theinside surface of the recess of the mold members 100, 400 by insertingand fitting the portion of the ceramic element body chip 1 into therecess of the mold members 100, 400. By performing heat processing onthe ceramic element body chip 1 in a state in which the surface of theportion of the ceramic element body chip 1 is in contact with the platedlayers 120, 420 formed on the inside surface of the recess of the moldmembers 100, 400, external conductor layers 12, 42 made of the platedlayer are formed on the surface of the portion of the ceramic elementbody chip 1. For this reason, the external conductor layers 12, 42 canbe formed on both side surfaces of the ceramic element body chip 1, asshown in FIG. 10, simply by using mold members 100, 400 having a recesson which plated layers 120, 420 are formed in advance, without usingcumbersome production steps of the masking step and the etching step. Inaddition, wrap-around ends of the external conductor layers 12, 42 canbe easily formed to extend up to both ends of the upper and lowersurfaces of the ceramic element body chip 1.

Here, by using mold members 100, 400 having a recess, the plated layers120, 420 formed in advance can be easily brought into contact with thesurface of the portion of the ceramic element body chip 1.

In the method of producing a laminated ceramic capacitor according to apreferred embodiment of the present invention, when the step of formingthe plated layers 120, 420 on the inside surface of the recess of themold members 100, 400 is carried out by electrolytic plating, and theportion of the mold members 100, 400 on which the plated layers 120, 420are to be formed is made of a conductor, and the portion of the moldmembers 100, 400 on which the plated layers are not to be formed is madeof an insulator, the plated layers 120, 420 can be easily formedselectively on only the portion of the conductor in the inside surfaceof the recess of the mold members 100, 400. Also, the plated layers 120,420 can be selectively formed or the plated layers 120, 420 can bepatterned without using cumbersome production steps of the masking stepand the etching step. This makes it possible for the production methodaccording to a preferred embodiment of the present invention to beapplied even to a case of producing a ceramic electronic componenthaving numerous terminals in which a plurality of external electrodesserving as external conductor layers 12, 42 are formed on the outersurface of the ceramic element body chip 1.

Here, the portion on which the plated layers 120, 420 are formed may bethe whole inside surface or a portion of the inside surface of therecess of the mold members 100, 400.

In the method of producing a laminated ceramic capacitor according to apreferred embodiment of the present invention, when the step of formingthe plated layers on the inside surface of the recess of the moldmembers 100, 400 is carried out by non-electrolytic plating, and theportion of the mold members 100, 400 on which the plated layers 120, 420are to be formed is made of a material that has a catalytic activitywith respect to the reducing agent contained in the non-electrolyticplating bath, and the portion of the mold members 100, 400 on which theplated layers are not to be formed is made of a material that does nothave a catalytic activity with respect to the reducing agent containedin the non-electrolytic plating bath, the plated layers 120, 420 can beeasily formed selectively on only the portion made of the materialhaving a catalytic activity in the inside surface of the recess of themold members 100, 400 by non-electrolytic plating. Also, the platedlayers 120, 420 can be selectively formed or the plated layers 120, 420can be patterned without using the cumbersome production steps of themasking step and the etching step. This makes it possible for theproduction method according to a preferred embodiment of the presentinvention to be applied even to a case of producing a ceramic electroniccomponent having numerous terminals in which a plurality of externalelectrodes serving as external conductor layers 12, 42 are formed on theouter surface of the ceramic element body chip 1.

Here, in this case also, the portion on which the plated layers 120, 420are formed may be the whole inside surface or a portion of the insidesurface of the recess of the mold members 100, 400.

Further, in the method of producing a laminated ceramic capacitoraccording to a preferred embodiment of the present invention describedabove, since the heat processing on the ceramic element body chip 1 iscarried out at a temperature higher than the temperature at which themetal contained in the plated layers 120, 420 reacts with oxygencontained in the ceramic element body chip 1 to yield a product, firmclose adhesion of the plated layers 120, 420 and the ceramic elementbody chip 1 with each other can be made by the presence of the product.By this process, the close adhesion property of the external conductorlayers 12, 42 made of the plated layers to the ceramic element body chip1 can be greatly improved.

Furthermore, by applying the production method according to a preferredembodiment of the present invention to the production of a laminatedceramic capacitor of chip type, a larger capacitance can be obtainedwith a smaller volume in a laminated ceramic capacitor.

FIG. 10 is a cross-sectional view illustrating a laminated ceramiccapacitor obtained by the production method according to a preferredembodiment of the present invention.

As shown in FIG. 10, external conductor layers 12, 42 made of a platedlayer are formed on the surfaces of both sides of the ceramic elementbody chip 1. The ceramic element body chip 1 includes a plurality oflaminated ceramic layers and a plurality of internal conductor layers 11arranged between the plurality of ceramic layers. The surface of aportion of the internal conductor layers 11 is exposed to the outsidesurface of the ceramic element body chip 1. Specifically, on thesurfaces of both sides of the ceramic laminate body 10, end surfaces ofthe plurality of internal conductor layers 11 are alternately exposed.The external conductor layers 12, 42 made of a plated layer are formedso as to be electrically connected to the one end surface of the exposedinternal conductor layers 11.

A case will be described in which a laminated ceramic capacitor which isone example of a plurality of ceramic electronic components by using theproduction method according to a preferred embodiment of the presentinvention is produced. In the plurality of laminated ceramic capacitors,external conductor layers 12, 42 made of a plated layer are formed onthe surface of a portion of each of the plurality of ceramic elementbody chips 1. The plurality of ceramic element body chips 1 have upperand lower surfaces and right and left side surfaces connecting the upperand lower surfaces. Regarding the plurality of external conductor layers12, 42, each of the external conductor layers 12, is arranged to extendfrom one end of the upper surface of each of the plurality of ceramicelement body chips 1 to one end of the lower surface by passing throughat least one of the left side surface and the right side surface. Asshown in FIG. 10, the ratio of the standard deviation relative to anaverage value of the lengths S of the plurality of external conductorlayers 12, 42 provided on the one end of either of the upper surface andthe lower surface of each of the plurality of ceramic element body chips1 is preferably about 3% or less, and more preferably about 1% or less,for example. The ratio of the standard deviation relative to an averagevalue of the thicknesses T of the plurality of external conductor layers12, 42 is preferably about 5% or less, and more preferably about 1% orless, for example.

In this manner, in the laminated ceramic capacitor produced by theproduction method according to a preferred embodiment of the presentinvention, the thickness of the plated layer constituting the externalconductor layers 12, 42 and the length of both ends of the plated layercan be controlled.

FIG. 11 is a block diagram showing a schematic construction of anapparatus for producing a laminated ceramic capacitor which is oneexample of a ceramic electronic component according to a preferredembodiment of the present invention.

Referring to FIG. 11, in the apparatus for producing a laminated ceramiccapacitor, as each station, a plating section S1, a water-washingsection S2, a drying section S3, a jig setting section S4, a chipinserting section S5, a jig removing section S6, a mold setting sectionS7, a heat processing section S8, and a chip collecting section S9 arepreferably successively disposed in a ring arrangement, for example.

The plating section S1 is a station in which a mold member 100 such asshown in FIG. 1 is prepared, and a plated layer 120 is formed on theinside surface of the recess of the mold member 100 as shown in FIG. 2.The water-washing section S2 is a station arranged to wash the moldmember 100 with water after the plated layer 120 is formed. The dryingsection S3 is a station arranged to dry the water-washed mold member100.

The jig setting section S4 is a station arranged to mount a ring-shapedchip guiding supporting jig 200 on the ceramic layer 110 so as tosurround the recess, as shown in FIG. 3.

The chip inserting section S5 is a station in which one side portion ofthe ceramic element body chip 1 of the laminated ceramic capacitor isguided by the inner circumferential surface of the chip guidingsupporting jig 200, and a portion of the ceramic element body chip 1 isinserted and fitted into the recess of the mold member 100, whereby thesurface of the portion of the ceramic element body chip 1, that is, thesurface on which the external conductor layer is to be formed, isbrought into contact with the plated layer 120 formed on the insidesurface of the recess of the mold member 100, as shown in FIG. 4.

The jig removing section S6 is a station arranged to remove the chipguiding supporting jig 200 from the mold member 100. The mold settingsection S7 is a station in which the other side portion on the oppositeside of the ceramic element body chip 1 of the laminated ceramiccapacitor is inserted and fitted into the recess of the other moldmember 400, whereby the surface of the other side portion serving as thesurface of one portion of the ceramic element body chip 1 is broughtinto contact with the plated layer 420 formed on the inside surface ofthe recess of the mold member 400, as shown in FIG. 6.

The heat processing section S8 is a station in which the mold member 100and the ceramic element body chip 1 are put into a heat processingfurnace 500 to perform heat processing in a state in which the surfaceof both sides of the ceramic element body chip 1 is in contact with theplated layers 120, 420, as shown in FIG. 7.

The chip collecting section S9 is a station in which the ceramic elementbody chip 1 on which the external conductor layers 12, 42 have beenformed is separated from the mold members 100, 400, as shown in FIG. 9.

The separated mold members 100, 400 are moved to the plating section S1and repetitively put to use.

In this manner, in the method or apparatus for producing a laminatedceramic capacitor which is one example of a ceramic electroniccomponent, a method or apparatus for producing an external conductorlayer being excellent in mass productivity can be provided.

Hereafter, with use of the apparatus shown in FIG. 11, each of theproduction steps was carried out as shown in FIGS. 1 to 9. By theelectrolytic plating method and the non-electrolytic plating method,external conductor layers 12, 42 made of a plated layer were formed onthe surface of both sides of a ceramic element body chip 1 of alaminated ceramic capacitor as shown in FIG. 10.

An example of the ceramic element body chip 1 of the laminated ceramiccapacitor had a prismatic shape with an approximate size of 1 mm×0.5mm×0.5 mm, for example. External conductor layers 12, 42 were formed astwo external electrode terminals on the laminated ceramic capacitor. Themajor component of the ceramic laminate body 10 was BaTiO₃, and thethickness of each ceramic layer constituting the ceramic laminate body10 was about 2 μm, for example. The major component of the internalconductor layer 11 serving as an internal electrode was Ni, and thethickness of each internal conductor layer 11 was about 1 μm, forexample.

In the case of forming a plated layer constituting the externalconductor layers 12, 42 by the electrolytic plating method, thecondition for forming the plated layer 120 on the inner wall surface ofthe recess of the mold member 100 was as follows, as shown in FIG. 2.The electrolytic plating bath was a pyrophosphoric acid serieselectrolytic Cu plating bath with a pH value of 8.6, a bath temperatureof 58° C., a pyrophosphoric acid concentration of 238 g/L, and a copperion concentration of 34 g/L, for example. As the barrel platingcondition, a horizontal barrel of 300 mL was used with a rotation numberof 20 rpm; the volume of the solder balls having a diameter of 0.7 mmwas set to be 70 mL; the chip volume was set to be 30 mL, and theenergization condition was set to be an electric current of 10 A for 180minutes; and the target value of the plated film thickness was set to be5 μm, for example.

In the case of forming a plated layer constituting the externalconductor layers 12, 42 by the non-electrolytic plating method, thecondition for forming the plated layer 120 on the inner wall surface ofthe recess of the mold member 100 was as follows, as shown in FIG. 2.The composition of the non-electrolytic plating bath was such thatcopper sulfate was 0.04 mol/L, formaldehyde as a reducing agent was 0.16mol/L, oxalic acid was 0.1 mol/L, polyethylene glycol was 1.0 g/L, andsodium hydroxide was 0.125 mol/L, for example.

The thickness of the plated layer 120 formed on the inner wall surfaceof the recess of the mold member 100 by the electrolytic plating methodor the non-electrolytic plating method in the plating section S1 of FIG.11 was about 5 μm, for example. In the drying section S3, thewater-washed mold member 100 was dried at a temperature of 300° C. for 3minutes, for example.

Also, in the heat processing section S8 of FIG. 11, the heat processingstep shown in FIG. 7 was carried out by holding the ceramic element bodychip 1 and the mold members 100, 400 for 10 seconds in the inside of aheat processing furnace having a temperature of 1700° C. and an oxygenconcentration of 50 ppm, for example.

In the above-described manner, as shown in FIG. 10, a plurality ofceramic element body chips 1 of a laminated ceramic capacitor on whichthe external conductor layers 12, 42 made of a plated layer had beenformed were fabricated.

With respect to the obtained numerous ceramic element body chips 1, thelength S of the wrap-around ends of the external conductor layers 12, 42and the thickness of the external conductor layers 12, 42 were measuredat arbitrary 50 points. As a result thereof, whether the externalconductor layers 12, 42 were formed with an electrolytically platedlayer or a non-electrolytically plated layer, the ratio of the standarddeviation relative to the average value or the target value of about 0.1mm of the length S was about 0.9%, and the ratio of the standarddeviation relative to the average value or the target value of about 5μm of the thickness T was about 0.8%, which were less than about 1%.From this, it will be understood that, in the laminated ceramiccapacitor produced by the production method according to a preferredembodiment of the present invention, the thickness of the plated layerconstituting the external conductor layers 12, 42 and the length of bothends of the plated layer could be controlled.

It is to be considered that the preferred embodiments and Examplesdisclosed herein are in all respects exemplary and not limitative. It isintended that the scope of the present invention is shown not by theabove-described preferred embodiments or Examples but by the appendedclaims, and includes all modifications and changes that are equivalentto and comprised within the scope of the claims.

While the present invention has been described with respect to preferredembodiments thereof, it will be apparent to those skilled in the artthat the disclosed invention may be modified in numerous ways and mayassume many preferred embodiments other than those specifically set outand described above. Accordingly, the appended claims are intended tocover all modifications of the present invention that fall within thetrue spirit and scope of the present invention.

What is claimed is:
 1. A method for producing a ceramic electroniccomponent including a ceramic element body, comprising: a step ofallowing a surface of at least a portion of the ceramic element body tobe brought into contact with a plated layer formed in advance on amember different from the ceramic element body; and a step of performingheat processing on said ceramic element body in a state in which thesurface of at least the portion of said ceramic element body is incontact with said plated layer, thereby to form an external conductorlayer made of said plated layer on the surface of the portion of saidceramic element body.
 2. A method for producing a ceramic electroniccomponent including a ceramic element body, comprising: a step offorming a plated layer on an inside surface of a recess of a mold memberinto which a portion of the ceramic element body can be inserted andfitted; a step of allowing a surface of the portion of the ceramicelement body to be brought into contact with said plated layer formed onthe inside surface of the recess of said mold member by inserting andfitting the portion of said ceramic element body into the recess of saidmold member; a step of performing heat processing on said ceramicelement body in a state in which the surface of the portion of saidceramic element body is in contact with said plated layer, thereby toform an external conductor layer made of said plated layer on thesurface of the portion of said ceramic element body; and a step ofseparating said ceramic element body, on which said external conductorlayer is formed, from said mold member.
 3. The method for producing aceramic electronic component according to claim 2, wherein the step offorming the plated layer on the inside surface of the recess of saidmold member is carried out by electrolytic plating, a portion of saidmold member on which the plated layer is to be formed is made of aconductor, and a portion of said mold member on which the plated layeris not to be formed is made of an insulator.
 4. The method for producinga ceramic electronic component according to claim 2, wherein the step offorming the plated layer on the inside surface of the recess of saidmold member is carried out by non-electrolytic plating, a portion ofsaid mold member on which the plated layer is to be formed is made of amaterial that has a catalytic activity with respect to a reducing agentcontained in a non-electrolytic plating bath, and a portion of said moldmember on which the plated layer is not to be formed is made of amaterial that does not have a catalytic activity with respect to thereducing agent contained in the non-electrolytic plating bath.
 5. Themethod for producing a ceramic electronic component according to claim1, wherein the heat processing on said ceramic element body is carriedout at a temperature higher than a temperature at which a metalcontained in said plated layer reacts with oxygen contained in saidceramic element body to yield a product.
 6. The method for producing aceramic electronic component according to claim 1, wherein said ceramicelement body includes a plurality of laminated ceramic layers and aplurality of internal conductor layers disposed between said pluralityof ceramic layers, a surface of a portion of said internal conductorlayers is exposed to an outside surface of said ceramic element body,and said external conductor layer is formed to be electrically connectedto said internal conductor layers in the step of forming the externalconductor layer made of said plated layer on the surface of the portionof said ceramic element body.
 7. A method for producing a ceramicelectronic component including a ceramic element body, the methodcomprising the sequentially performed steps of: forming a plated layeron an inside surface of a recess of a mold member into which a portionof the ceramic element body is to be inserted and fitted; allowing asurface of the portion of the ceramic element body to be brought intocontact with said plated layer formed on the inside surface of therecess of said mold member by inserting and fitting the portion of saidceramic element body into the recess of said mold member; performingheat processing on said ceramic element body in a state in which thesurface of the portion of said ceramic element body is in contact withsaid plated layer, thereby to form an external conductor layer made ofsaid plated layer on the surface of the portion of said ceramic elementbody; and separating said ceramic element body, on which said externalconductor layer is formed, from said mold member.
 8. The method forproducing a ceramic electronic component according to claim 7, wherein aplated layer is formed on an inside surface of a recess of a first moldmember, and a plated layer is formed on an inside surface of a recess ofa second mold member in the step of forming the plated layer on theinside surface of the recess of the mold member, a surface of a portionon one side of said ceramic element body is brought into contact withsaid plated layer formed on the inside surface of the recess of saidfirst mold member by inserting and fitting the portion on the one sideof said ceramic element body into the recess of said first mold member,and a surface of a portion on the other side opposite to the one side ofsaid ceramic element body is brought into contact with said plated layerformed on the inside surface of the recess of said second mold member byinserting and fitting the portion on the other side of said ceramicelement body into the recess of said second mold member in the step ofallowing the surface of the portion of the ceramic element body to bebrought into contact with said plated layer formed on the inside surfaceof the recess of said mold member.
 9. The method for producing a ceramicelectronic component according to claim 1, wherein a major component ofsaid plated layer is nickel or copper.
 10. An apparatus for producing aceramic electronic component including a ceramic element body, theapparatus comprising: a first station arranged to form a plated layer onan inside surface of a recess of a mold member into which a portion ofthe ceramic element body can be inserted and fitted; a second stationarranged to allow a surface of the portion of said ceramic element bodyto be brought into contact with said plated layer formed on the insidesurface of the recess of said mold member by inserting and fitting theportion of said ceramic element body into the recess of said moldmember; a third station arranged to perform heat processing on saidceramic element body in a state in which the surface of the portion ofsaid ceramic element body is in contact with said plated layer, therebyto form an external conductor layer made of said plated layer on thesurface of the portion of said ceramic element body; and a fourthstation arranged to separate said ceramic element body, on which saidexternal conductor layer is formed, from said mold member; wherein thefirst station, the second station, the third station and the fourthstation are successively arranged in this order.
 11. The apparatus forproducing a ceramic electronic component according to claim 10, whereinthe first station arranged to form the plated layer on the insidesurface of the recess of the mold member includes a station arranged toform a plated layer on an inside surface of a recess of a first moldmember, and a station arranged to form a plated layer on an insidesurface of a recess of a second mold member, and the second stationarranged to allow the surface of the portion of the ceramic element bodyto be brought into contact with said plated layer formed on the insidesurface of the recess of said mold member includes a station arranged toallow a surface of a portion on one side of said ceramic element body tobe brought into contact with said plated layer formed on the insidesurface of the recess of said first mold member by inserting and fittingthe portion on the one side of said ceramic element body into the recessof said first mold member, and a station arranged to allow a surface ofa portion on the other side opposite to the one side of said ceramicelement body to be brought into contact with said plated layer formed onthe inside surface of the recess of said second mold member by insertingand fitting the portion on the other side of said ceramic element bodyinto the recess of said second mold member.